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Polyimide Shape SA101D
Super Thermal Resistant Polyimide Shape Antistatic Grade
CEPLA SA101

Polyimide Shape is used widely in semiconductor device and manufacturing equipment parts of many other electronic devices. When used as the manufacturing equipment parts, the electrostatic discharge may occur depending on the application. To prevent the electrostatic hazard, we have developed the antistatic polyimide shape, CEPLA SA101-D

CEPLA SA101D  Super High Heat-Resistant Polyimide Resin   Antistatic Grade Properties of CEPLA SA101D　(Standard Size : 150□ｘ40t   150□ｘ50t)

Property

Item

Unit

Test Method ASTM

Testing Temperature

CEPLA SA101D

General Properties

Component

--

--

--

BPDA Polyimide

Relative Density

--

D-792

23ºc

1.46

Absorption

%

D-570

23ºc

0.06(24h)

Mechanical Properties

Tensile Strength

MPa

D-638

23ºc

61

260ºc

43

Elongation

%

D-638

23ºc

0.65

260ºc

0.98

Flexural Strength

MPa

D-790

23ºc

95

260ºc

49

Flexural Modulus

GPa

D-790

23ºc

6.8

260ºc

3.6

Compressive Stress (1% distortion)

MPa

D-695

23ºc

66

Compressive Elasticity Modulus

GPa

D-695

23ºc

6.98

Izod Impact Strength (Notched)

J/Min

D-256

23ºc

13.0

Rockwell Hardness

M-Scale

D-785

23ºc

117

Thermal Properties

Heat Distortion Temperature (18.56kgf/cm²)

ºc

D-648

--

470

Coefficient of Linear Thermal Expansion

Ppm/ºc

E-233

--

34.2
(20~450ºc)

Electrical Properties

Volume Resistivity

Ω-cm

D-257

23ºc

1.4X103

Surface Resistivity

Ω

D-257

23ºc

4.5X104